Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly

In the rapid growth of the semiconductor industry, subcontractors are highly competitive to gain their market segment and sustain the business. The ability to meet the shipment commits is critical, often gated by the process cycle time. Increasing challenges arise with high product customization in a make-to-order (MTO) environment. Such a company is Carsem (M) Sdn. Bhd. which had faced the issues of long cycle time resulting in shipment de-commits, and profit loss. The manual planning procedure could not cater to the demands of a quick turnaround for complex products